The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2003
Filed:
Mar. 20, 2002
Cheng-Heng Kao, Tao-Yuang, TW;
Cheng-En Ho, Taipei, TW;
National Central University, Taoyuan Hsien, TW;
Abstract
The present invention relates to a method for controlling the formation of the intermetallic compounds in solder joints, The types of the intermetallic compounds between the SnAgCu solders and the Ni-bearing substrate can be controlled by adjusting the copper concentration in the SnAgCu solders. If the SnAgCu solder has a copper concentration higher than or equivalent to 0.6 wt. %, the soldering intermetallic compound includes a continuous (Cu Ni ) Sn layer. If the copper concentration of the SnAgCu solders is lower than or equivalent to 0.4 wt. %, the soldering intermetallic compound includes a continuous (Ni Cu ) Sn layer and a non-continuous (Cu Ni ) Sn layer. If the copper concentration of the SnAgCu solders is between 0.4 wt. % to 0.6 wt. %, the soldering intermetallic compound includes the continuous (Cu Ni ) Sn .
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile