Cheng-En Chung

This inventor holds 15 USPTO granted patents, primarily in Semiconductor Packaging. Top assignee: Gudeng Precision Industrial Co., Ltd.. Active years: 2022-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Cheng-En Chung. Retrieved from https://idiyas.com/inventor/cheng-en-chung

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 15

% Patents Active = 100.0

Average Co-Inventor Count = 5.4

ph-index = 2

Forward Citations = 13(Granted Patents)

Company Filing History:

15 out of 131

Gudeng Precision Industrial Co., Ltd.

patents

Years Active: 2022-2025

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Areas of Expertise:

Substrate Container

Reticle Box

Transport Solution

Wafer Container

Support Module

Protection Device

Locking Mechanism

Flow Field

Shelf Module

Central Support Device

15 patents (USPTO):Sort by Forward CitationsExplore Patents

1. D1096169 - Support for lower cover of reticle box (2025-10-07),

2. 12431375 - Protection device for substrate container (2025-09-30),

3. D1068701 - Box for transporting boards (2025-04-01),

4. D1068700 - Box for transporting boards (2025-04-01),

5. 12243762 - Door locking mechanism and semiconductor container using the same (2025-03-04),

6. 12237190 - Supporting shelf module and wafer container using same (2025-02-25),

7. 12183608 - Substrate container with enhanced flow field therein (2024-12-31),

8. 11987431 - Top-opening substrate carrier (2024-05-21),

9. D1013822 - Support for upper cover of reticle box (2024-02-06),

10. 11508594 - Substrate container system (2022-11-22),

11. D969485 - Box for transporting boards (2022-11-15),

12. D957815 - Reticle box (2022-07-19),

13. D951208 - Connector for reticle box (2022-05-10),

14. 11292637 - Central support device for supporting plate-shaped object and storage apparatus for storing plate-shaped object (2022-04-05),

15. D944220 - Reticle box (2022-02-22),

Title: Cheng-En Chung: Innovator in Substrate Protection Technology

Introduction

Cheng-En Chung is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of substrate protection technology, holding a total of 15 patents. His innovative designs focus on enhancing the safety and reliability of substrate containers, which are crucial in various industrial applications.

Latest Patents

Among his latest patents is a device titled "Support for Lower Cover of Reticle Box." This invention is a protection device for substrate containers that includes a container door and a limiter for securing a substrate. It features a support member and an elastic connecting component that engage and secure the container body. Additionally, it incorporates an antistatic member that provides an electrostatic dissipation path, ensuring electrostatic protection for the substrate. This device significantly improves the protection of substrates stored in containers, preventing hazards caused by vibration, dust, and static electricity.

Career Highlights

Cheng-En Chung is currently employed at Gudeng Precision Industrial Co., Ltd., where he continues to develop innovative solutions for substrate protection. His work has been instrumental in advancing the technology used in substrate containers, making them safer and more efficient for industrial use.

Collaborations

Cheng-En has collaborated with notable colleagues, including Ming-Chien Chiu and Yung-Chin Pan. Their combined expertise has contributed to the successful development of various innovative products in the field.

Conclusion

Cheng-En Chung's contributions to substrate protection technology exemplify his commitment to innovation and excellence. His patents reflect a deep understanding of the challenges faced in the industry and provide effective solutions to enhance substrate safety.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]