Cheng-Chuan Lee

Title: Cheng-Chuan Lee: Innovator in Chemical Mechanical Polishing Technology

Introduction

Cheng-Chuan Lee is a notable inventor based in Fenyuan, Taiwan. He has made significant contributions to the field of chemical mechanical polishing (CMP) processes. His innovative approach has led to advancements in the efficiency and effectiveness of multi-layer CMP techniques.

Latest Patents

Cheng-Chuan Lee holds a patent for a "Control system for multi-layer chemical mechanical polishing process and control method for the same." This patent describes a method for controlling an apparatus to perform a multi-layer CMP process with a specific polishing rate across multiple process runs. The method involves receiving post-CMP thickness information from a multilayered structure on a wafer and determining the appropriate CMP process time for subsequent runs. This innovation enhances the precision of the CMP process, ensuring optimal results.

Career Highlights

Cheng-Chuan Lee is associated with United Microelectronics Corporation, a leading company in the semiconductor industry. His work at this organization has allowed him to apply his expertise in CMP technology, contributing to the development of advanced manufacturing processes.

Collaborations

Cheng-Chuan Lee has collaborated with notable colleagues, including Ming-Hsin Yeh and Yi-Ching Wu. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas within the field.

Conclusion

Cheng-Chuan Lee's contributions to the chemical mechanical polishing process exemplify the impact of innovative thinking in technology. His patent and work at United Microelectronics Corporation highlight his role as a key figure in advancing semiconductor manufacturing techniques.