This inventor holds 1 USPTO granted patent. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2005.
Company Filing History:
Years Active: 2005
Title: Cheng-Chian Chiang: Innovator in Semiconductor Packaging
Introduction
Cheng-Chian Chiang is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly in enhancing the performance and cost-effectiveness of memory chips. With a focus on innovation, he has secured a patent that showcases his expertise and creativity in this technical domain.
Latest Patents
Cheng-Chian Chiang holds a patent for a semiconductor package designed for memory chips. This innovative package includes two substrates, each equipped with multiple electrical connection pads. At least one chip is mounted on each substrate, and an encapsulation body is formed to protect the chips. The design allows for electrical connections to be made to the pads, which are strategically exposed from the cover. The rectangular shape of the substrates and cover enhances the overall efficiency of the package. This design not only incorporates multiple chips to improve performance and memory capacity but also reduces fabrication costs by utilizing smaller substrates compared to prior art. He has 1 patent to his name.
Career Highlights
Cheng-Chian Chiang is associated with Siliconware Precision Industries Co., Ltd., a company known for its advancements in semiconductor technology. His work has contributed to the company's reputation as a leader in the industry. His innovative approach to semiconductor packaging has positioned him as a key figure in the field.
Collaborations
Cheng-Chian has collaborated with talented coworkers such as Chih-Ming Huang and Chin-Huang Chang. Their combined expertise has fostered an environment of innovation and creativity within their projects.
Conclusion
Cheng-Chian Chiang's contributions to semiconductor packaging exemplify the spirit of innovation in technology. His patent reflects a commitment to enhancing memory chip performance while reducing costs. His work continues to influence the semiconductor industry positively.