Tokyo, Japan

Cheng Cheng

This inventor holds 3 USPTO granted patents. Top assignee: Ebara Corporation. Active years: 2022-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Cheng Cheng. Retrieved from https://idiyas.com/inventor/cheng-cheng-6zd52pii

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.6

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2022-2024

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3 patents (USPTO):Explore Patents

Title: The Innovative Journey of Cheng Cheng

Introduction

Cheng Cheng is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of technology, holding a total of three patents. His work is characterized by a commitment to innovation and excellence.

Latest Patents

One of Cheng's latest patents is an elastic membrane, which showcases his ability to create advanced materials for various applications. This invention reflects his dedication to pushing the boundaries of technology and improving existing solutions.

Career Highlights

Cheng Cheng is currently employed at Ebara Corporation, a company known for its cutting-edge technology and engineering solutions. His role at Ebara has allowed him to further develop his skills and contribute to impactful projects.

Collaborations

Cheng has had the opportunity to work alongside talented individuals such as Shingo Togashi and Kenichi Akazawa. These collaborations have enriched his experience and fostered a creative environment for innovation.

Conclusion

Cheng Cheng's journey as an inventor is marked by his innovative spirit and dedication to advancing technology. His contributions, particularly in the realm of elastic membranes, highlight his role as a key player in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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