Hsinchu, Taiwan

Cheng-Che Tsai

This inventor holds 1 USPTO granted patent. Top assignee: Vanguard International Semiconductor Corporation. Active years: 2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Cheng-Che Tsai. Retrieved from https://idiyas.com/inventor/cheng-che-tsai-itpzss18

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2011

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1 patent (USPTO):Explore Patents

Title: Cheng-Che Tsai: Innovator in Semiconductor Fabrication

Introduction

Cheng-Che Tsai is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the integration of CMOS and BJT devices. His innovative approaches have paved the way for advancements in electronic device fabrication.

Latest Patents

Cheng-Che Tsai holds a patent titled "Fabrication methods for integration CMOS and BJT devices." This patent presents methods for integrating complementary metal-oxide-semiconductor (CMOS) devices with bipolar junction transistors (BJT) on a semiconductor substrate. The process involves providing a substrate with distinct regions for each device type, depositing a dielectric layer, and carefully removing portions to achieve the desired integration.

Career Highlights

Cheng-Che Tsai is associated with Vanguard International Semiconductor Corporation, where he applies his expertise in semiconductor fabrication. His work has been instrumental in enhancing the performance and efficiency of electronic components.

Collaborations

Cheng-Che Tsai has collaborated with notable colleagues, including Yu-Hsun Chen and Yung-Lung Chou. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Cheng-Che Tsai's contributions to semiconductor technology exemplify the impact of innovative thinking in the field. His patent on integrating CMOS and BJT devices showcases his commitment to advancing electronic device fabrication.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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