Fongyuan, Taiwan

Chender Chen


Average Co-Inventor Count = 1.4

ph-index = 1

Forward Citations = 11(Granted Patents)


Company Filing History:


Years Active: 2012-2016

Loading Chart...
9 patents (USPTO):Explore Patents

Title: Innovations of Chender Chen

Introduction

Chender Chen is a prominent inventor based in Fongyuan, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of nine patents. His work focuses on improving integrated circuit packaging and wire bonding techniques.

Latest Patents

One of Chender Chen's latest patents is titled "Ball grid array package with laser vias and methods for making the same." This invention involves a packaged integrated circuit (IC) that includes a die with bond pads, wire bonds, and a substrate designed to connect the wire bonds to external package connectors. The substrate features mechanical vias and laser vias, with the laser vias positioned closer to the die. The method outlined in this patent includes routing traces and forming both mechanical and laser vias to enhance electrical connections.

Another notable patent is the "Lead frame apparatus and method for improved wire bonding." This invention presents a lead frame that accommodates a semiconductor die, featuring a die attach pad and two sets of conductive finger ends arranged in elongated regions. The innovative design allows for improved wire bonding efficiency.

Career Highlights

Chender Chen is currently employed at Marvell International Limited, where he continues to develop cutting-edge technologies in semiconductor packaging. His expertise in the field has led to advancements that benefit various applications in electronics.

Collaborations

Chender has collaborated with notable colleagues, including Chenglin Liu and Shiann-Ming Liou, to further enhance the innovations in their respective projects.

Conclusion

Chender Chen's contributions to semiconductor technology through his patents demonstrate his commitment to innovation and excellence in the field. His work continues to influence the industry and pave the way for future advancements.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…