The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2013
Filed:
Sep. 28, 2011
Applicants:
Chender Chen, Fongyuan, TW;
Chenglin Liu, San Jose, CA (US);
Shiann-ming Liou, Campbell, CA (US);
Inventors:
Assignee:
Marvell International Ltd., Hamilton, BM;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/28 (2006.01);
U.S. Cl.
CPC ...
Abstract
Embodiments of the present disclosure describe semiconductor device packaging techniques and devices that incorporate a heat spreader into the insulating material of a packaged semiconductor device. In one embodiment, a device comprising a semiconductor device is coupled to a substrate, and insulating material covers (i) a portion of the semiconductor device and (ii) a portion of the substrate. The device also comprises a heat spreader embedded in the insulating material and the heat spreader is isolated from the substrate at least in part by the insulating material.