Chen-Wei Chang

Title: Chen-Wei Chang and Chemical Mechanical Polishing Innovation.

Introduction

Chen-Wei Chang is an inventor based in San Jose, California, whose patent work includes a technique for improving process monitoring during chemical mechanical polishing. The invention uses sensor data to help estimate layer thickness and guide polishing decisions.

Latest Patents

Chang is associated with 1 patent, titled “Generation of Background Signal Sequence Using an In-Situ Monitoring System in Chemical Mechanical Polishing.” The technique stores a sequence of background traces collected as an in-situ sensor scans a substrate. During polishing, the system repeatedly sweeps the sensor across the substrate and subtracts the corresponding background trace from each measured trace. It then uses the modified traces to generate estimated thickness values, which can support endpoint detection or adjustments to polishing parameters.

Career Highlights

Chang’s listed company affiliation is Applied Materials, Inc. His patent reflects work on using in-situ monitoring data to support control of chemical mechanical polishing processes.

Collaborations

Chang’s listed coworkers include Kun Xu and Jimin Zhang. Their names are provided as professional associations, though the available information does not specify their roles in the patent.

Conclusion

Chen-Wei Chang’s patent describes a sensor-based approach to refining polishing control by accounting for background signals and using estimated thickness values to inform process decisions.