The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2026
Filed:
Feb. 20, 2024
Applied Materials, Inc., Santa Clara, CA (US);
Kun Xu, Sunol, CA (US);
Jimin Zhang, San Jose, CA (US);
Chen-Wei Chang, San Jose, CA (US);
Haosheng Wu, San Jose, CA (US);
Patrick A. Higashi, Hacienda Heights, CA (US);
Jianshe Tang, San Jose, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
A polishing control technique includes storing data representing a sequence of background traces generated by a sequence of scans of a sensor of an in-situ monitoring system across a substrate, and polishing a layer on a substrate. The layer is monitored during the polishing with the in-situ monitoring system, including repeatedly sweeping the sensor of the in-situ monitoring system across substrate such that each sweep provides a measured trace. For each measured trace, a respective background trace that has an equivalent position in the sequence of background traces is subtracted from the measured trace to generate a modified trace, and a sequence of estimated thickness values is generated based on the modified traces. A polishing endpoint is detected or a polishing parameter is modified based on the sequence of estimated thickness values.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile