Chen-Nan Lai

Title: Innovations of Chen-Nan Lai in Chip Packaging Technology

Introduction

Chen-Nan Lai is a prominent inventor based in Shenzhen, China. He has made significant contributions to the field of chip packaging technology, holding a total of three patents. His work focuses on enhancing the efficiency and effectiveness of chip stacking and packaging structures.

Latest Patents

One of Chen-Nan Lai's latest patents is a chip stacking and packaging structure. This innovative design includes a substrate, a first chip stacked on the substrate, a heat dissipation module, and a second chip stacked on the heat dissipation module. The structure features first bonding pads and second bonding pads arranged on the substrate, with first welding pins on the first chip that are electrically connected to the first bonding pads. The heat dissipation module is designed with a first groove, a cooling liquid cavity, a liquid inlet, a liquid outlet, and first conductive columns. This design allows for efficient heat management and electrical connectivity between the chips.

Another notable patent is related to a chip packaging device, chip packaging method, and package chip. This device includes conductive sheets, a vacuum suction movable assembly, and a heating assembly. The variable suction surface of the assembly is capable of sucking multiple conductive sheets, which are then pressed onto corresponding bonding pads and welding pins. The heating assembly plays a crucial role in heating solders on these pads and pins, ensuring a reliable connection.

Career Highlights

Chen-Nan Lai is currently employed at Hosin Global Electronics Co., Ltd., where he continues to innovate in the field of electronics. His work has been instrumental in advancing chip packaging technologies, which are essential for modern electronic devices.

Collaborations

Some of his notable coworkers include Qingshui Liu and Yisheng Wu, who contribute to the collaborative efforts in research and development at Hosin Global Electronics Co., Ltd.

Conclusion

Chen-Nan Lai's contributions to chip packaging technology demonstrate his expertise and innovative spirit. His patents reflect a commitment to improving electronic device performance through advanced packaging solutions.