For the Inventor, By the Inventor

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Shenzhen, China

Hosin Global Electronics Co., Ltd

USPTO Granted Patents = 4

Forward Citations = 0

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12 inventors (with patents filed for the assignee):

Chen-Nan Lai (3 out of 3 patents)

Tsung-Lin Wu (1 out of 3 patents)

Qian Wang (1 out of 103 patents)

4. Jie Zhang (1 out of 95 patents)

5. Yisheng Wu (1 out of 1 patent)

6. Qingshui Liu (1 out of 1 patent)

7. Chao-Yu Chen (1 out of 1 patent)

8. Kai Qiang Meng (1 out of 1 patent)

9. Qi Ming Zhu (1 out of 1 patent)

10. Wu Du (1 out of 1 patent)

11. Hai Liang Wu (1 out of 1 patent)

12. Xiao Min Chen (1 out of 1 patent)

4 patents: Sort by Forward Citations

1. 12367139 - Memory control method and storage device (2025-07-22),

2. 11876037 - Chip stacking and packaging structure (2024-01-16),

3. 11764184 - Chip packaging device, chip packaging method, and package chip (2023-09-19),

4. 11609713 - Storage device and storage control method (2023-03-21),

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USPTO Data Jan 1 1976 - Jan 6 2026

4 Patents

#870 in Shenzhen

#5,610 in China

Shenzhen, China

Hosin Global Electronics Co., Ltd

Forward Citations = 0

12 inventors:

Chen-Nan Lai (3 out of 3 patents)

Tsung-Lin Wu (1 out of 3 patents)

Qian Wang (1 out of 103 patents)

4. Jie Zhang (1 out of 95 patents)

5. Yisheng Wu (1 out of 1 patent)

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