Chen-Nan Chiu

Title: Chen-Nan Chiu: Innovator in Semiconductor Packaging

Introduction

Chen-Nan Chiu is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 2 patents. His work focuses on improving the reliability and structural integrity of semiconductor packages.

Latest Patents

One of Chen-Nan Chiu's latest patents is titled "Semiconductor package with ball grid array connection having improved reliability." This invention includes a substrate and at least one integrated circuit (IC) die. The substrate solder resist has openings that expose bonding pads, while the die solder resist has aligned openings for the IC die bonding pads. A ball grid array (BGA) connects these pads, enhancing the reliability of the semiconductor package. Another notable patent is "Semiconductor packages with crack preventing structure." This patent describes a semiconductor package that includes a substrate, an interconnect structure, and multiple passivation layers designed to prevent cracks and improve durability.

Career Highlights

Chen-Nan Chiu is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His innovative work has contributed to advancements in semiconductor technology, making him a valuable asset to his company.

Collaborations

Throughout his career, Chen-Nan Chiu has collaborated with talented individuals such as Yao-Chun Chuang and Yu-Sheng Lin. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Chen-Nan Chiu is a distinguished inventor whose work in semiconductor packaging has led to significant advancements in the field. His patents reflect a commitment to improving the reliability and performance of semiconductor devices.