This inventor holds 1 USPTO granted patent. Top assignee: Chipbond Technology Corporation. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Innovations of Chen-Lung Teng
Introduction
Chen-Lung Teng is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of electroless plating and related processes. His innovative designs have led to advancements in the efficiency and effectiveness of various industrial applications.
Latest Patents
Chen-Lung Teng holds a patent for a clamp assembly. This clamp assembly is designed to securely hold a workpiece during electroless plating, etching, electroplating, or cleaning processes. The assembly features a base mounted on a carrier, which includes a guide hole and a first limiting hole. The clamping element consists of a guide rod and a second limiting hole, allowing for precise alignment and integration of the components. This innovative design enhances the clamping process, ensuring stability and reliability during operations. He has 1 patent to his name.
Career Highlights
Chen-Lung Teng is currently employed at Chipbond Technology Corporation, where he continues to develop and refine his inventions. His work has been instrumental in improving manufacturing processes within the company. His expertise in clamp assembly design has positioned him as a valuable asset in the field of technology.
Collaborations
Throughout his career, Chen-Lung Teng has collaborated with talented individuals such as Ching-Wen Chen and Kung-An Lin. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Chen-Lung Teng's contributions to the field of technology, particularly through his patent for a clamp assembly, demonstrate his commitment to innovation. His work at Chipbond Technology Corporation and collaborations with fellow inventors highlight the importance of teamwork in advancing technological solutions.