Chen-Lin Li

Title: Innovations of Chen-Lin Li in Soldering Technology.

Introduction

Chen-Lin Li is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of soldering technology, particularly in the design of package structures that prevent solder overflow. His innovative approach addresses common challenges faced in electronic packaging.

Latest Patents

Chen-Lin Li holds a patent for a "Package structure preventing solder overflow on substrate solder pads." This invention includes a plurality of die pins, solders, and substrate solder pads. The design features die pins located under a die, with substrate solder pads formed on the upper surface of a substrate through copper plating or etching. Each substrate solder pad has at least one solder pad connection point, with solders connecting the die pins to these points. The unique aspect of this patent is the incorporation of solder pad ridges and grooves, which, when filled with solder or resin, effectively prevent solder overflow.

Career Highlights

Chen-Lin Li is currently employed at Kinsus Interconnect Technology Corporation, where he continues to innovate in the field of electronic packaging. His work has been instrumental in enhancing the reliability and efficiency of soldering processes in various applications.

Collaborations

One of his notable collaborators is Jun-Chung Hsu, with whom he has worked closely on various projects related to soldering technology.

Conclusion

Chen-Lin Li's contributions to soldering technology through his innovative patent demonstrate his expertise and commitment to advancing the field. His work not only addresses existing challenges but also paves the way for future developments in electronic packaging.