Hsinchu, Taiwan

Che-Wei Lin

This inventor holds 6 USPTO granted patents. Top assignees: Industrial Technology Research Institute, Au Optronics Corporation. Active years: 2005-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Che-Wei Lin. Retrieved from https://idiyas.com/inventor/che-wei-lin-rggb69x5

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 33.3

Average Co-Inventor Count = 4.0

ph-index = 3

Forward Citations = 27(Granted Patents)


Company Filing History:


Years Active: 2005-2023

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6 patents (USPTO):Explore Patents

Title: Che-Wei Lin: Innovator in Fingerprint Sensing and Heat Dissipation Technologies

Introduction

Che-Wei Lin is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the fields of fingerprint sensing and heat dissipation technologies. With a total of 6 patents to his name, Lin's work showcases his innovative spirit and technical expertise.

Latest Patents

One of Lin's latest patents is a fingerprint sensing apparatus. This apparatus includes a first substrate, a light sensing structure, a second substrate, a lens layer, a filler, and a first light shielding layer. The light sensing structure is positioned on a sensing area of the first substrate, while the lens layer is placed on the second substrate. The lens layer features multiple first convex portions and a first concave portion. The filler is situated between the lens layer and the light sensing structure, with a refractive index greater than that of the lens layer. The first light shielding layer is located between the second substrate and the lens layer, overlapping the first convex portions and aligning with the first concave portion.

Another notable patent is a method for fabricating a heat dissipating apparatus. This method involves two highly heat conductive members with structured patterns. A highly heat conductive material is coated on these patterns to form a micro-structure layer. The two members are then assembled to create a heat dissipating apparatus that includes a main body composed of the highly heat conductive members. This main body forms an accommodating cavity, with inner surfaces that create the micro-structure layer. A working fluid is filled into the cavity to transfer heat from a heat absorbing surface to a heat dissipating surface.

Career Highlights

Throughout his career, Che-Wei Lin has worked with notable organizations such as the Industrial Technology Research Institute and AU Optronics Corporation. His experience in these companies has allowed him to develop and refine his innovative ideas.

Collaborations

Lin has collaborated with talented individuals in his field, including Lan-Kai Yeh and Ming-Jye Tsai. These collaborations have contributed to the advancement of his projects and patents.

Conclusion

Che-Wei Lin is a distinguished inventor whose work in fingerprint sensing and heat dissipation technologies has made a significant impact. His innovative patents and collaborations reflect his dedication to advancing technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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