The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2009
Filed:
Apr. 17, 2007
Lan-kai Yeh, Hsinchu, TW;
Che-wei Lin, Hsinchu, TW;
Ming-jye Tsai, Hsinchu, TW;
Shao-wen Chen, Hsinchu, TW;
Jin-cherng Shyu, Hsinchu, TW;
Lan-Kai Yeh, Hsinchu, TW;
Che-Wei Lin, Hsinchu, TW;
Ming-Jye Tsai, Hsinchu, TW;
Shao-Wen Chen, Hsinchu, TW;
Jin-Cherng Shyu, Hsinchu, TW;
Industrial Technology Research Institute, Hsinchu Hsien, TW;
Abstract
A heat dissipating apparatus has a micro-structure layer. Two highly heat conductive members are provided, each having structured patterns. A highly heat conductive material is coated on the structured patterns by injection molding for forming a micro-structure layer. The two highly heat conductive members are assembled to form a heat dissipating apparatus having a micro-structure layer. The heat dissipating apparatus includes a main body composed of the highly heat conductive members. The main body forms an accommodating cavity, and inner surfaces of the accommodating cavity form the micro-structure layer. A working fluid is filled into the accommodating cavity for transferring heat from a heat absorbing surface to a heat dissipating surface.