Lan-Kai Yeh

Title: Innovations of Lan-Kai Yeh in Heat Dissipation Technology

Introduction

Lan-Kai Yeh is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of heat dissipation technology, holding a total of 5 patents. His work focuses on methods for fabricating advanced heat dissipating apparatuses that enhance thermal management in various applications.

Latest Patents

One of his latest patents is a method of fabricating a heat dissipating apparatus. This invention relates to a method that provides two highly heat conductive members with structured patterns. A highly heat conductive material is coated on these structured patterns to form a micro-structure layer. The two members are then assembled to create a heat dissipating apparatus that includes a main body composed of these highly conductive members. This main body forms an accommodating cavity, with the inner surfaces of the cavity featuring the micro-structure layer. A working fluid is filled into the cavity to transfer heat from a heat absorbing surface to a heat dissipating surface. Another patent focuses on a heat dissipating apparatus that also incorporates a micro-structure layer, utilizing injection molding to coat the structured patterns with a highly conductive material.

Career Highlights

Lan-Kai Yeh is affiliated with the Industrial Technology Research Institute, where he continues to innovate in the field of thermal management. His work has been instrumental in developing efficient heat dissipation solutions that are crucial for various technological applications.

Collaborations

He has collaborated with notable colleagues such as Che-Wei Lin and Ming-Jye Tsai, contributing to advancements in their shared field of expertise.

Conclusion

Lan-Kai Yeh's innovative approaches to heat dissipation technology have positioned him as a key figure in this area. His patents reflect a commitment to enhancing thermal management solutions, which are vital for the performance of modern technologies.