Che Kiong Hor

Title: Innovations by Che Kiong Hor

Introduction

Che Kiong Hor is an accomplished inventor based in Perak, Malaysia. He has made significant contributions to the field of semiconductor technology. His innovative approach has led to the development of a unique method that enhances the reliability of packaged semiconductor die.

Latest Patents

Che Kiong Hor holds a patent for a method and wafer for maintaining ultra clean bonding pads on a wafer. This invention teaches a sawn wafer with ultra clean bonding pads on die, which enhances the strength of wire bonds. As a result, it leads to higher yield and improved reliability of packaged semiconductor die. The clean wafers, ready for dicing, are coated with a removable insulating water-soluble non-ionic film. This film enhances clean saw cuts and reduces buildup. The protective film is hardened by heat and resists removal by cooling water used in dicing saws. However, after dicing, the protective film can be removed in a wafer washer using high-pressure warm D.I. water. After the removal of the protective film, the electrode pads are virtually as clean as before dicing. The film may also be used as a protective layer until the sawn wafer is ready for use. Che Kiong Hor has 1 patent to his name.

Career Highlights

Che Kiong Hor is currently associated with Keteca Singapore, a company known for its advancements in semiconductor technology. His work has significantly impacted the efficiency and reliability of semiconductor manufacturing processes.

Collaborations

Che Kiong Hor collaborates with Robert C Runyon, contributing to the innovative projects at Keteca Singapore.

Conclusion

Che Kiong Hor's contributions to semiconductor technology through his innovative patent demonstrate his expertise and commitment to enhancing manufacturing processes. His work continues to influence the industry positively.