The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2003
Filed:
Jul. 12, 2002
Robert Carrol Runyon, Sun City West, AZ (US);
Che Kiong Hor, Perak, MY;
Keteca Singapore Singapore, , SG;
Abstract
The present invention teaches a sawn wafer with ultra clean bonding pads on die which enhance the strength of wire bond and results in higher yield and improved reliability of packaged semiconductor die. Clean wafers ready for dicing are coated with a removable insulating water soluble non-ionic film which enhances clean saw cuts and reduces buildup. The protective film is hardened by heat and resists removal by cooling water used in dicing saws. However, after dicing the protective film is removable in a wafer washer using high pressure warm D.I. water. After removal of the protective film the electrode pads are virtually as clean as before dicing. The film may be used as a protective layer until the sawn wafer is ready for use.