Company Filing History:
Years Active: 2014
Title: Che-Chin Chang: Innovator in Semiconductor Technology
Introduction
Che-Chin Chang is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative designs and methods. His work has been recognized in the industry, showcasing his expertise and dedication to advancing technology.
Latest Patents
Che-Chin Chang holds a patent for "Semiconductor packages with lead extensions and related methods." This invention involves a semiconductor package that features a die pad, a die positioned on the die pad, and a first lead surrounding the die pad. The first lead includes a contact element, an extension element that extends substantially in the direction of the die pad, and a concave surface located between the contact element and the extension element. Additionally, a second lead with a concave surface is also positioned around the die pad, with the concave surfaces of the first and second leads oriented in opposite directions. This innovative design enhances the functionality and efficiency of semiconductor packages.
Career Highlights
Che-Chin Chang is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to develop cutting-edge semiconductor technologies. His work at this leading company has allowed him to collaborate with other talented professionals in the field, furthering advancements in semiconductor packaging.
Collaborations
Some of Che-Chin Chang's notable coworkers include Lin-Wang Yu and Ping-Cheng Hu. Their collaborative efforts contribute to the innovative environment at Advanced Semiconductor Engineering, Inc., fostering the development of new technologies and solutions.
Conclusion
Che-Chin Chang's contributions to semiconductor technology through his patent and work at Advanced Semiconductor Engineering, Inc. highlight his role as an influential inventor in the industry. His innovative designs continue to shape the future of semiconductor packaging.