Advanced Semiconductor Engineering, Inc.

Che-Chin Chang

Yu-Fang Tsai

Ping-Cheng Hu

Lin-Wang Yu

A semiconductor package with a die pad, a die disposed on the die pad, and a first lead disposed about the die pad. The first lead includes a contact element, an extension element extending substantially in the direction of the die pad, and a concave surface disposed between the contact element and the extension element. A second lead having a concave surface is also disposed about the die pad. The first lead concave surface is opposite in direction to the second lead concave surface.

Growing community of inventors

Kaohsiung, Taiwan

Che-Chin Chang