Che C Wei

Title: Innovations by Che C Wei

Introduction

Che C Wei is an accomplished inventor based in Plano, TX (US). He has made significant contributions to the field of semiconductor technology, holding two patents that enhance interconnect formation in electronic devices. His work focuses on improving the efficiency and reliability of electrical connections within integrated circuits.

Latest Patents

Che C Wei's latest patents include "Self-aligned contact formation" and "Method for self-aligned polysilicon contact formation." Both patents describe a process where a polycrystalline silicon layer is deposited and patterned to define a level of interconnect. Contact openings to lower conductive layers are then defined and patterned. A refractory metal, such as tungsten, is selectively deposited over the device, ensuring adherence to the polycrystalline silicon in the interconnect leads and the silicon of the lower conductive layer exposed in the contact openings. This technique provides a low resistance interconnect and establishes good metal contacts to underlying layers. Additionally, shared contacts between multiple polycrystalline silicon interconnect layers and underlying conductive layers, such as a substrate, can be easily formed using this method.

Career Highlights

Che C Wei is currently employed at SGS-Thomson Microelectronics Limited, where he continues to innovate in the semiconductor industry. His work has been instrumental in advancing technologies that are critical for modern electronic devices.

Collaborations

Throughout his career, Che has collaborated with notable colleagues, including Chiara Zaccherini and Robert O Miller. These partnerships have contributed to the successful development of his patented technologies.

Conclusion

Che C Wei's contributions to semiconductor technology through his innovative patents demonstrate his expertise and commitment to advancing the field. His work continues to impact the efficiency of electronic devices, showcasing the importance of innovation in technology.