This inventor holds 5 USPTO granted patents. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2004-2009.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Kaohsiung, TW (2006)
- Tainan, TW (2004 - 2009)
Company Filing History:
Years Active: 2004-2009
Title: Innovations of Chaur-Chin Yang
Introduction
Chaur-Chin Yang is a prominent inventor based in Tainan, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 5 patents. His work focuses on developing advanced packaging solutions that enhance the performance and reliability of electronic devices.
Latest Patents
One of his latest innovations is the flip-chip package. This design features a substrate with an opening, where a dummy die is placed to create a composite chip carrier with a chip cavity. The dummy die includes a redistribution layer with multiple flip-chip pads for connecting a chip, as well as connecting pads for the substrate. This configuration allows for a thinner package thickness, improved heat dissipation, and reduced stress on the chip.
Another notable patent is the stack type flip-chip package. This invention includes a substrate board, a first chip, a second chip, packaging material, and a heat sink. The substrate board is equipped with bump contacts that connect to the first chip's bonding pads. The first chip also has a redistribution circuit that connects to the second chip, allowing for efficient thermal management through direct bonding of a heat sink.
Career Highlights
Chaur-Chin Yang is currently employed at Advanced Semiconductor Engineering, Inc., a leading company in the semiconductor industry. His expertise in flip-chip technology has positioned him as a key player in the development of innovative packaging solutions.
Collaborations
Throughout his career, Yang has collaborated with notable colleagues, including Hsueh-Te Wang and Sung-Fei Wang. These partnerships have contributed to the advancement of semiconductor technologies and the successful implementation of his patented designs.
Conclusion
Chaur-Chin Yang's contributions to semiconductor packaging through his innovative patents have significantly impacted the industry. His work continues to pave the way for advancements in electronic device performance and reliability.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile