Location History:
- Kaohsiung, TW (2006)
- Tainan, TW (2004 - 2009)
Company Filing History:
Years Active: 2004-2009
Title: Innovations of Chaur-Chin Yang
Introduction
Chaur-Chin Yang is a prominent inventor based in Tainan, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 5 patents. His work focuses on developing advanced packaging solutions that enhance the performance and reliability of electronic devices.
Latest Patents
One of his latest innovations is the flip-chip package. This design features a substrate with an opening, where a dummy die is placed to create a composite chip carrier with a chip cavity. The dummy die includes a redistribution layer with multiple flip-chip pads for connecting a chip, as well as connecting pads for the substrate. This configuration allows for a thinner package thickness, improved heat dissipation, and reduced stress on the chip.
Another notable patent is the stack type flip-chip package. This invention includes a substrate board, a first chip, a second chip, packaging material, and a heat sink. The substrate board is equipped with bump contacts that connect to the first chip's bonding pads. The first chip also has a redistribution circuit that connects to the second chip, allowing for efficient thermal management through direct bonding of a heat sink.
Career Highlights
Chaur-Chin Yang is currently employed at Advanced Semiconductor Engineering, Inc., a leading company in the semiconductor industry. His expertise in flip-chip technology has positioned him as a key player in the development of innovative packaging solutions.
Collaborations
Throughout his career, Yang has collaborated with notable colleagues, including Hsueh-Te Wang and Sung-Fei Wang. These partnerships have contributed to the advancement of semiconductor technologies and the successful implementation of his patented designs.
Conclusion
Chaur-Chin Yang's contributions to semiconductor packaging through his innovative patents have significantly impacted the industry. His work continues to pave the way for advancements in electronic device performance and reliability.