The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 27, 2004
Filed:
Apr. 23, 2002
Chaur-Chin Yang, Tainan, TW;
Hsueh-Te Wang, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A stack type flip-chip package that utilizes a redistribution circuit on the back of a chip to serve as a bridge for connecting with other chips. The package includes at least a substrate, a first chip, a second chip, some underfill material and some packaging material. The substrate has a plurality of bump contacts and a plurality of line contacts thereon. The first chip has an active surface with a plurality of first bonding pads thereon. The back surface of the first chip has a redistribution circuit. The redistribution circuit has a plurality of bump pads and a plurality of line pads thereon. The second chip has an active surface with a plurality of second bonding pads thereon. Bumps are positioned between the bump contacts and the first bonding pads and between the bump pads and the second bonding pads. Conductive wires connect the line contacts and the line pads. The underfill material fills the space between the chip and the substrate and the gap between the first and the second chips. The packaging material encloses the chips and the conductive wires.