Chaung-Lin Lai

Title: Innovations of Chaung-Lin Lai in Chip Packaging Technology.

Introduction

Chaung-Lin Lai is a prominent inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of chip packaging technology, holding a total of six patents. His work focuses on innovative methods for forming chip packages that enhance performance and reliability.

Latest Patents

Lai's latest patents include a method for forming a chip package that features first and second stacks of dummy metal layers surrounding the sensing region. This method involves providing a substrate with a chip region and a scribe-line region, followed by the formation of a dielectric layer on the substrate's upper surface. A dummy structure is created in the dielectric layer over the scribe-line region, which extends along the edges of the chip region. The dummy structure consists of concentric stacks of dummy metal layers. The process also includes a sawing operation that forms a saw opening through the dielectric layer, ensuring that at least the first stack of dummy metal layers remains intact after sawing.

Another patent by Lai describes a chip package formation method that begins with a substrate having upper and lower surfaces, along with a dielectric layer on its upper surface. A masking layer is applied to cover the dielectric layer, featuring an opening that exposes the dielectric layer. An etching process is then performed to create a second opening in the dielectric layer, followed by a dicing process through this opening.

Career Highlights

Chaung-Lin Lai is currently employed at Xintec Corporation, where he continues to innovate in the field of semiconductor packaging. His expertise in chip packaging technology has positioned him as a key figure in the industry.

Collaborations

Lai collaborates with talented coworkers, including Tsang-Yu Liu and Shu-Ming Chang, who contribute to the advancement of their projects and innovations.

Conclusion

Chaung-Lin Lai's contributions to chip packaging technology through his patents and work at Xintec Corporation highlight his role as an influential inventor in the semiconductor industry. His innovative methods continue to shape the future of chip packaging.