Company Filing History:
Years Active: 2014-2015
Title: Chaun-Yu Wu: Innovator in Semiconductor Packaging
Introduction
Chaun-Yu Wu is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 2 patents. His work focuses on innovative structures and methods that enhance the efficiency and reliability of semiconductor devices.
Latest Patents
One of his latest patents is titled "Semiconductor package structure and method for making the same." This invention describes a semiconductor package structure that includes a first substrate, a second substrate, and an encapsulant. The first substrate is designed with a plurality of first bumps and first solder layers, each featuring a cone-shaped slot with an inner surface. The second substrate also comprises a plurality of second bumps and second solder layers, where each second solder layer is a cone-shaped body. This innovative design allows the second solder layer to couple with the first solder layer, ensuring a secure connection. The encapsulant is formed between the first and second substrates, providing additional structural integrity.
Career Highlights
Chaun-Yu Wu is currently employed at Chipbond Technology Corporation, where he continues to develop cutting-edge semiconductor technologies. His expertise in semiconductor packaging has positioned him as a key player in the industry, contributing to advancements that benefit various electronic applications.
Collaborations
Throughout his career, Chaun-Yu Wu has collaborated with notable colleagues, including Chin-Tang Hsieh and Chih-Ming Kuo. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.
Conclusion
Chaun-Yu Wu's contributions to semiconductor packaging exemplify the importance of innovation in technology. His patents reflect a commitment to enhancing the performance and reliability of semiconductor devices, making him a valuable asset in the field.