Chau H Duong

Title: Innovations by Inventor Chau H Duong

Introduction

Chau H Duong is a notable inventor based in Newark, DE (US). He has made significant contributions to the field of chemical mechanical polishing, holding two patents that showcase his innovative approach to materials and methods.

Latest Patents

One of his latest patents is for an acrylate polyurethane chemical mechanical polishing layer. This polishing pad comprises an acrylate polyurethane polishing layer that exhibits a tensile modulus of 65 to 500 MPa, an elongation to break of 50 to 250%, a storage modulus, G', of 25 to 200 MPa, a Shore D hardness of 25 to 75, and a wet cut rate of 1 to 10 µm/min. Another patent details a method for polishing a substrate using a pad that includes a polymeric matrix with microspheres dispersed within it. This polymeric matrix is formed of a water-based polymer or blends thereof, applied on a permeable substrate, and results in reduced defectivity and improved polishing performance.

Career Highlights

Chau H Duong is currently employed at Rohm and Haas Electronic Materials CMP Holdings, Inc. His work focuses on advancing the technology behind chemical mechanical polishing, which is crucial in the semiconductor manufacturing process.

Collaborations

He has collaborated with notable coworkers such as Jia Xie and David B James, contributing to the development of innovative solutions in his field.

Conclusion

Chau H Duong's contributions to the field of chemical mechanical polishing through his patents and collaborations highlight his role as a significant inventor in the industry. His work continues to influence advancements in materials and methods used in semiconductor manufacturing.