Rohm and Haas Electronic Materials Cmp Holdings, Inc.

Chau H Duong

David B James

Jia Xie

A chemical mechanical polishing pad comprising an acrylate polyurethane polishing layer, wherein the polishing layer exhibits a tensile modulus of 65 to 500 MPa; an elongation to break of 50 to 250%; a storage modulus, G', of 25 to 200 MPa; a Shore D hardness of 25 to 75; and a wet cut rate of 1 to 10 &#x3bc;m/min.

Acrylate polyurethane chemical mechanical polishing layer

A method for polishing a substrate using a pad comprising, a polymeric matrix having microspheres dispersed therein, the polymeric matrix being formed of a water-based polymer or blends thereof, wherein the polymeric matrix is applied on a permeable substrate, and wherein the polishing pad exhibits reduced defectivity and improved polishing performance are provided.

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Newark, DE, United States of America

Chau H Duong