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For the Inventor, By the Inventor

Taoyuan, Taiwan

Chau-Chun Wen

This inventor holds 10 USPTO granted patents and 1 published patent application. Top assignee: Cyntec Company. Active years: 2009-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chau-Chun Wen. Retrieved from https://idiyas.com/inventor/chau-chun-wen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 10 

% Patents Active = 100.0

Average Co-Inventor Count = 3.3

ph-index = 4

Forward Citations = 30(Granted Patents)


Location History:

  • Pingjhen, TW (2009)
  • Taoyuan, TW (2012)
  • Taoyuan County, TW (2011 - 2021)

Company Filing History:

goldMedal10 out of 231 
 
Cyntec Company
 patents

Years Active: 2009-2021

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10 patents (USPTO):Explore Patents
1. 10991681 - Three-dimensional package structure (2021-04-27),
2. 10593656 - Three-dimensional package structure (2020-03-17),
3. 9601412 - Three-dimensional package structure (2017-03-21),
4. 8837168 - Electronic package structure (2014-09-16),
5. 8824165 - Electronic package structure (2014-09-02),
6. 8338933 - Three-dimensional package structure (2012-12-25),
7. 8338928 - Three-dimensional package structure (2012-12-25),
8. 8247891 - Chip package structure including heat dissipation device and an insulation sheet (2012-08-21),
9. 7982304 - Chip package structure (2011-07-19),
10. 7551455 - Package structure (2009-06-23),

Title: Innovations of Chau-Chun Wen in Three-Dimensional Package Structures

Introduction

Chau-Chun Wen is a prominent inventor based in Taoyuan County, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 10 patents. His work focuses on innovative three-dimensional package structures that enhance the efficiency and functionality of electronic devices.

Latest Patents

One of Chau-Chun Wen's latest patents is a three-dimensional package structure that includes an energy storage element, a semiconductor package body, and a shielding layer. The semiconductor package body features multiple second conductive elements and at least one control device. The energy storage element, which includes a magnetic body, is electrically connected to the second conductive elements. This design allows for effective integration with external devices, particularly in Point of Load (POL) converters. Another notable patent describes a three-dimensional package structure where the first conductive element comprises a top surface, a bottom surface, and a lateral surface. The conductive pattern is disposed on the top surface, with a second conductive element connected to the conductive pattern, enhancing the overall performance of the package.

Career Highlights

Chau-Chun Wen is currently employed at Cyntec Company, where he continues to innovate in the field of semiconductor technology. His expertise in three-dimensional packaging has positioned him as a key player in advancing electronic device efficiency.

Collaborations

Chau-Chun Wen has collaborated with notable colleagues, including Da-Jung Chen and Chun-Tiao Liu, contributing to various projects that push the boundaries of semiconductor packaging technology.

Conclusion

Chau-Chun Wen's innovative work in three-dimensional package structures has significantly impacted the semiconductor industry. His patents reflect a commitment to enhancing electronic device performance and efficiency.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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