Chau-Chun Wen

Title: Innovations of Chau-Chun Wen in Three-Dimensional Package Structures

Introduction

Chau-Chun Wen is a prominent inventor based in Taoyuan County, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 10 patents. His work focuses on innovative three-dimensional package structures that enhance the efficiency and functionality of electronic devices.

Latest Patents

One of Chau-Chun Wen's latest patents is a three-dimensional package structure that includes an energy storage element, a semiconductor package body, and a shielding layer. The semiconductor package body features multiple second conductive elements and at least one control device. The energy storage element, which includes a magnetic body, is electrically connected to the second conductive elements. This design allows for effective integration with external devices, particularly in Point of Load (POL) converters. Another notable patent describes a three-dimensional package structure where the first conductive element comprises a top surface, a bottom surface, and a lateral surface. The conductive pattern is disposed on the top surface, with a second conductive element connected to the conductive pattern, enhancing the overall performance of the package.

Career Highlights

Chau-Chun Wen is currently employed at Cyntec Company, where he continues to innovate in the field of semiconductor technology. His expertise in three-dimensional packaging has positioned him as a key player in advancing electronic device efficiency.

Collaborations

Chau-Chun Wen has collaborated with notable colleagues, including Da-Jung Chen and Chun-Tiao Liu, contributing to various projects that push the boundaries of semiconductor packaging technology.

Conclusion

Chau-Chun Wen's innovative work in three-dimensional package structures has significantly impacted the semiconductor industry. His patents reflect a commitment to enhancing electronic device performance and efficiency.