The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2014
Filed:
Jul. 19, 2011
Applicants:
Da-jung Chen, Taoyuan County, TW;
Chau-chun Wen, Taoyuan County, TW;
Chun-tiao Liu, Hsinchu, TW;
Inventors:
Assignee:
Cyntec Co. Ltd, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.
Chen, Da-Jung. (2014). Electronic package structure (U.S. Patent No. 8824165). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8824165
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile