The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2011
Filed:
Aug. 12, 2009
Bau-ru LU, Changhua County, TW;
Chau-chun Wen, Taoyuan County, TW;
Da-jung Chen, Taoyuan County, TW;
Chun-hsien LU, Hsinchu, TW;
Bau-Ru Lu, Changhua County, TW;
Chau-Chun Wen, Taoyuan County, TW;
Da-Jung Chen, Taoyuan County, TW;
Chun-Hsien Lu, Hsinchu, TW;
Cyntec Co., Ltd., Hsinchu, TW;
Abstract
A chip package structure including a substrate, at least one chip, a heat dissipation device, at least one first conductive bar, a molding compound, and at least one second conductive bar is provided. The chip and the heat dissipation device are respectively disposed on a first and a second surface of the substrate. The first conductive bar has two opposite end surfaces, wherein one end surface is disposed on the first surface of the substrate, the other end surface is extended away from the substrate, and a fastening slot is disposed between the two end surfaces and passes through the other end surface. The molding compound encapsulates the substrate, the chip, part of the heat dissipation device, and the first conductive bar. The second conductive bar is disposed on one surface of the molding compound and has a protrusion portion fastened to the fastening slot of the first conductive bar.