This inventor holds 1 USPTO granted patent. Top assignee: International Business Machines Corporation. Active years: 1993.
Company Filing History:
Years Active: 1993
Title: Innovations of Charles T Randolph
Introduction
Charles T Randolph is an accomplished inventor based in Vestal, NY (US). He holds a patent for a significant innovation in the field of solder application. His work has contributed to advancements in technology, particularly in the area of fine pitch leads suitable for direct chip attachment and flip-chip applications.
Latest Patents
Randolph's notable patent is titled "Fine pitch solder application." This invention provides methods and apparatus for applying solder in precise amounts to fine pitch leads. The patent describes the use of a heated platen to apply pressure to solder overlaying a plurality of lands on a circuitized substrate. In one embodiment, paste solder is screened through a mask with apertures corresponding to land locations. Another embodiment involves accurately positioning a web of solder foil over fine pitch lands. Each embodiment features a heated platen with at least one active element that matches the size and shape of the area with fine pitch lands.
Career Highlights
Charles T Randolph is associated with the International Business Machines Corporation, commonly known as IBM. His work at IBM has allowed him to explore and develop innovative solutions in the field of electronics and soldering techniques.
Collaborations
Randolph has collaborated with notable coworkers, including Arthur L Leerssen and Everitt W Mace. Their combined expertise has likely contributed to the success of their projects and innovations.
Conclusion
Charles T Randolph's contributions to the field of solder application demonstrate his innovative spirit and technical expertise. His patent reflects a significant advancement in technology that benefits various applications in electronics.