International Business Machines Corporation

Charles T Randolph

Issa S Mahmoud

Everitt W Mace

Arthur L Leerssen

Phong T Truong

John Reece

Gaston G Settle

Srini V Vasan

Methods and apparatus are provided for applying solder in precise amounts to fine pitch leads such as those suitable for direct chip attachment (DCA) or flip-chip applications by using a heated platen to apply pressure to solder overlaying a plurality of lands on circuitized substrate. In one embodiment paste solder screened through a mask having apertures each corresponding to a plurality of land locations. In another embodiment, a web of solder foil is accurately positioned over a plurality of fine pitch lands. In each embodiment, a heated platen includes at least one active element corresponding in size and shape to the area having a plurality of fine pitch lands. A third embodiment includes individual platens for lands to which solder is to be applied.

Fine pitch solder application

Growing community of inventors

Vestal, NY, United States of America

Charles T Randolph