Kokomo, IN, United States of America

Charles T Eytcheson

This inventor holds 17 USPTO granted patents and 1 EPO patent, primarily in Semiconductor Packaging. Top assignees: Delco Electronics Corporation, Delphi Technologies, Inc., Gm Global Technolgoy Operations, Inc.. Active years: 1980-2005.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Charles T Eytcheson. Retrieved from https://idiyas.com/inventor/charles-t-eytcheson

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0


Average Co-Inventor Count = 2.3

ph-index = 11

Forward Citations = 349(Granted Patents)


Location History:

  • Macy, IN (US) (1980)
  • Kokomo, IN (US) (1985 - 2005)

Company Filing History:


Years Active: 1980-2005

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Areas of Expertise:
Heatsink Buffer Configuration
Circuit Component Mounting
Semiconductor Substrate
Dual Switch Module
Transistor Switch Module
Coaxial Switch Module
Electron Beam Welding
Laser Beam Welding
Through Hole Printing
Lead Frame Design
Power Semiconductor Device
Substrate Assembly
17 patents (USPTO):Explore Patents

Title: The Innovative Mind of Charles T. Eytcheson

Introduction

Charles T. Eytcheson is a prominent inventor based in Kokomo, Indiana, known for his contributions to thermal management and circuit component assembly. With an impressive portfolio of 17 patents, Eytcheson has made significant strides in enhancing the functionality and efficiency of various electronic systems. His work has been influential in shaping modern technology through innovative solutions.

Latest Patents

Among his latest innovations, Eytcheson devised a unique heatsink buffer configuration. This invention features a backplate that defines a heat transfer passage, where a thermally conductive buffer element is strategically positioned. This design provides a thermal conduit through the backplate, enhancing heat dissipation in electronic components.

Another noteworthy patent focuses on a method of mounting circuit components and a joint structure designed for this purpose. This joint structure involves a mesh that is infiltrated by solder material, where the mesh is made from a material with higher thermal conductivity than the solder. This configuration allows for improvements in thermal and electrical conductivity, reflow processing, and stress distribution between connected structures, showcasing Eytcheson's ingenuity in solving complex engineering challenges.

Career Highlights

Eytcheson's career includes significant tenure at well-known companies like Delco Electronics Corporation and General Motors Global Technology Operations LLC. His technical expertise and innovations have greatly contributed to advancements in the electronics field, particularly in thermal management and electronic assembly processes.

Collaborations

Throughout his career, Eytcheson has collaborated with many industry professionals, including noteworthy coworkers like Donald E. Lake, who is now deceased, and Aiman I. Alhoussami. These collaborations have facilitated knowledge exchange and fostered innovation in the technologies they developed together.

Conclusion

Charles T. Eytcheson exemplifies the spirit of innovation in the field of electronics and thermal management. His patents not only represent technical advancements but also a commitment to improving the efficiency and effectiveness of electronic systems. As he continues to innovate, Eytcheson's work will undoubtedly have a lasting impact on the industry, inspiring future inventors to follow in his footsteps.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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