Charles E Schmitz

Title: The Innovations of Charles E Schmitz

Introduction

Charles E Schmitz is a notable inventor based in Granada Hills, CA (US). He has made significant contributions to the field of electronic assembly, holding 2 patents that showcase his innovative spirit and technical expertise.

Latest Patents

One of his latest patents is for a stackable electronic assembly. This invention provides a stackable chip-scale package aimed at improving memory density, which can be mounted within a limited area or module. A novel staggered routing scheme enables the use of the same trace routing at every level of the stacked architecture, allowing for efficient access to individual memory devices in a chip-scale package stack. The architecture employs a ball grid array chip-scale package design combined with thermally compatible materials, which decreases the risk of thermal cracking while enhancing heat dissipation. Additionally, this design permits the mounting of support components, such as capacitors and resistors, on the chip-scale package.

Career Highlights

Charles E Schmitz is currently associated with Sanmina-SCI Corporation, where he continues to innovate and contribute to advancements in electronic assembly technologies. His work has been instrumental in developing solutions that address the challenges of modern electronics.

Collaborations

Throughout his career, Schmitz has collaborated with talented individuals such as Mark Ellsberry and Chi She Chen. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Charles E Schmitz exemplifies the spirit of innovation in the field of electronic assembly. His contributions, particularly in stackable electronic assembly, highlight his commitment to advancing technology and improving memory density solutions.