This inventor holds 2 USPTO granted patents. Top assignee: Endicott Interconnect Technologies, Inc.. Active years: 2007-2009.
Company Filing History:
Years Active: 2007-2009
Title: Charles E. Danoski: Innovator in Circuitized Substrate Technology
Introduction
Charles E. Danoski is a notable inventor based in Endicott, NY (US). He has made significant contributions to the field of circuitized substrate technology, holding 2 patents that focus on improving impedance control in electrical assemblies.
Latest Patents
Danoski's latest patents include a method of making a circuitized substrate with improved impedance control circuitry. This innovative method is designed to substantially eliminate impedance disruptions during the passage of signals through the substrate's circuitry. The produced substrate features a first conductive layer with multiple conductors, allowing for the positioning and electrical coupling of components. The design incorporates signal lines that are strategically placed between the first conductive layer and a voltage plane within a third conductive layer. This configuration enhances the performance of electrical assemblies and information handling systems, such as computers.
Career Highlights
Danoski is associated with Endicott Interconnect Technologies, Inc., where he applies his expertise in developing advanced circuitized substrates. His work has been instrumental in creating solutions that address the challenges of signal integrity in electronic devices.
Collaborations
Throughout his career, Danoski has collaborated with talented individuals such as Irving Memis and Steven G. Rosser. These partnerships have contributed to the advancement of technology in the field of circuitized substrates.
Conclusion
Charles E. Danoski's innovative work in circuitized substrate technology has made a significant impact on the electronics industry. His patents reflect a commitment to enhancing the performance and reliability of electrical assemblies.