Company Filing History:
4 out of 410 
2 out of 3 Years Active: 1987-2006
Title: The Innovative Contributions of Charles Balian
Introduction
Charles Balian is a notable inventor based in Guilford, CT (US), recognized for his significant contributions to thermal interface materials. With a total of 6 patents to his name, Balian has made strides in enhancing the efficiency of heat transfer in various applications.
Latest Patents
One of Balian's latest patents is a thermal interface material that utilizes a low melting alloy. This innovative composition undergoes a viscoelastic change at microprocessor operating temperatures, effectively transferring heat generated by a heat source, such as a microprocessor, to a heat sink. The composition includes a low melting alloy dispersed in a matrix, which comprises a viscoelastic material that softens at the operating temperature of the heat source. This allows the thermal interface composition to flow under pressure, ensuring optimal thermal contact between the heat source and the heat sink. When the heat source reaches its operating temperature, the viscoelastic composition softens, and the low melting alloy melts, forming a highly thermally conductive mixture that efficiently transfers heat.
Another notable patent is the self-adhering thermal interface material, which further showcases Balian's expertise in this field.
Career Highlights
Throughout his career, Charles Balian has worked with prominent companies, including Saint-Gobain Performance Plastics Corporation and Chr Industries, Inc. His work has significantly impacted the development of materials that enhance thermal management in electronic devices.
Collaborations
Balian has collaborated with talented individuals such as James H. Duvall and Steve Bergerson, contributing to the advancement of thermal interface technologies.
Conclusion
Charles Balian's innovative work in thermal interface materials has made a lasting impact on the field of heat transfer technology. His patents reflect a commitment to improving efficiency and performance in electronic applications.