The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 20, 2004

Filed:

Apr. 16, 2002
Applicant:
Inventors:

James H. Duvall, Mentor, OH (US);

Steve Bergerson, Milford, CT (US);

Charles Balian, Guilford, CT (US);

Arthur H. Rogove, South Glastonbury, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/12 ;
U.S. Cl.
CPC ...
B32B 7/12 ;
Abstract

A thermal interface material (A) transfers heat from a heat source ( ), such as a microprocessor, to a heat sink ( ) for maintaining the microprocessor at a safe operating temperature. The interface material includes thermally conductive filler particles dispersed in a phase change material. The phase change material softens and flows at the operating temperature of the heat source, thereby providing good thermal contact with uneven surfaces of the heat source and heat sink, without excessive exudation and loss of the interface material. The phase change material includes a polymer component, such as an elastomer, and a melting point component, which adjusts the softening temperature of the phase change material to the operating temperature of the heat source.


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