Company Filing History:
Years Active: 2015-2017
Title: Innovations of Chaohong Wu
Introduction
Chaohong Wu is an accomplished inventor based in Mountain View, CA (US). He holds a total of 4 patents that showcase his expertise in various technological fields. His work has significantly contributed to advancements in inspection methods and document image processing.
Latest Patents
One of his latest patents is titled "Context-based inspection for dark field inspection." This patent describes methods and systems for detecting defects on a wafer. The method involves altering design clips based on their appearance in the output generated by a wafer inspection process. It also includes aligning these altered design clips to the output during the inspection process and detecting defects based on this alignment.
Another notable patent is "Removal of underlines and table lines in document images while preserving intersecting character strokes." This method focuses on removing horizontal and vertical lines in document images while maintaining the integrity of character strokes that intersect these lines. The process involves calculating a vertical run length profile for detected horizontal lines and identifying areas that correspond to intersections with non-vertical lines. This innovative approach allows for the removal of lines in tables and forms while extracting handwriting or printed characters.
Career Highlights
Chaohong Wu has worked with prominent companies such as Konica Minolta Laboratory U.S.A., Inc. and Kla Tencor Corporation. His experience in these organizations has allowed him to develop and refine his innovative ideas, leading to the successful patents he holds today.
Collaborations
Some of his notable coworkers include Wei Ming and Yong Zhang. Their collaboration has likely contributed to the development of his innovative patents and advancements in their respective fields.
Conclusion
Chaohong Wu's contributions to technology through his patents reflect his dedication to innovation and problem-solving. His work continues to influence the fields of wafer inspection and document image processing.