Company Filing History:
8 out of 88 
2 out of 19,772 
Years Active: 2000-2002
Title: Innovations of Chao-Yang Lee
Introduction
Chao-Yang Lee is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of heat dissipation technology, holding a total of 10 patents. His work focuses on improving the efficiency and effectiveness of heat sinks used in electronic devices.
Latest Patents
One of his latest patents is a heat sink assembly designed for dissipating heat from an electronic package mounted on an electrical socket. This innovative assembly includes a heat sink and a latching member that secures it to the socket. The heat sink features a base plate with multiple upward-projecting fins, creating a receiving channel for the latching member. Additionally, positioning tabs ensure that the heat sink remains securely in place on the CPU.
Another notable patent is a heat dissipation device for integrated circuits. This device comprises a heat sink and an assembling device that secures the heat sink to a chip mounted on a printed circuit board. The heat sink is equipped with ears that define apertures, allowing for the assembly of clips, sleeves, and springs to ensure a stable connection to the printed circuit board.
Career Highlights
Chao-Yang Lee has worked with several notable companies, including Foxconn Precision Components Co., Ltd. and Hon Hai Precision Industry Co., Ltd. His experience in these organizations has allowed him to develop and refine his innovative ideas in heat dissipation technology.
Collaborations
Throughout his career, Chao-Yang Lee has collaborated with talented individuals such as Chung-Yung Sun and Chao Kun Tseng. These partnerships have contributed to the advancement of his inventions and the successful implementation of his patented technologies.
Conclusion
Chao-Yang Lee's contributions to heat dissipation technology have made a significant impact in the electronics industry. His innovative patents and collaborations highlight his dedication to improving the efficiency of electronic devices. His work continues to influence the development of advanced thermal management solutions.