Foxconn Precision Components Co., Ltd.

Hon Hai Precision Industry Co., Ltd.

Chao-Yang Lee

Chao Kun Tseng

Chung-Yung Sun

Wei-Ta Lo

Yeu-Lih Lin

Hsien-Shen Pei

Chung-Tung Sun

A heat sink assembly for an electrical socket of the present invention comprises a heat sink and a latching member latching with a pair of lugs on the socket. The heat sink comprises a base plate and a plurality of fins projecting upward therefrom. A receiving channel is integrally formed between the fins in the base plate for receiving the latching member. A pair of positioning tabs depends downward from a bottom surface of the base plate to tightly engage in a slit between the electric socket and a CPU mounted thereon for positioning the heat sink assembly on the CPU and keeping it from moving along the CPU. The receiving channel and the fins extend in a first direction while the tabs extend in a second direction vertical to the first direction.

Heat sink assembly for dissipating heat of an electronic package mounted on an electrical socket

A heat dissipation device includes a heat sink ( ) and an assembling device for securing the heat sink to a, chip ( ) mounted on a printed circuit board ( ). The heat sink has a pair of ears ( ) each defining an aperture ( ) therein. The assembling device includes a clip ( ), a pair of sleeves ( ) each defining a cavity ( ) therethrough, and a pair of springs ( ). Each sleeve extends through the aperture of a corresponding ear of the heat sink, and the springs are disposed respectively between the ears and an end of the sleeves. The clip has a pair of posts ( ) for extending through the printed circuit board to engage with the corresponding cavities.

Heat dissipation device for integrated circuits

A heat sink system assembled within a computer enclosure for dissipating heat away from a heat generating element comprises a fan duct, a heat pipe and a fan. The computer enclosure forms an opening. The fan duct is a square hollow shell attached to the computer enclosure, with a surface thereof coupled to the computer enclosure near the opening. A first hole is defined in the surface of the fan duct in communication with the opening, thereby communicating with an exterior of the computer enclosure. A second hole is defined in another surface of the fan duct in communication with an interior of the computer enclosure. The heat pipe includes a main body and two attaching portions at opposite ends thereof for being respectively attached to the heat generating element and the fan duct. The main body has a conductive material disposed therein. The fan is assembled within the first hole.

Heat sink system

A heat sink includes a base and a number of fins extending from a top face of the base. A groove is defined in a bottom face of the base opposite the fins for receiving a flip chip of a flip chip processor thereby reducing damage to the flip chip during mounting the heat sink to the flip chip processor. At least one elongate protrusion extends from the base for engaging with an edge of a substrate of the flip chip processor to properly position the heat sink with respect to the flip chip processor.

Heat sink for integrated circuit

A heat sink system assembled within a computer enclosure for dissipating heat away from a heat generating element includes a fan duct, a heat pipe and a fan. The computer enclosure forms an opening. The fan duct is a square hollow shell attached to the computer enclosure, with a surface thereof coupled to the computer enclosure. A first hole is defined in the surface of the fan duct in communication with the opening, thereby communicating with an exterior of the computer enclosure. A second hole is defined in another surface of the fan duct in communication with an interior of the computer enclosure. The heat pipe includes a main body and two attaching portions at opposite ends thereof for being respectively attached to the heat generating element and the fan duct. The main body has a conductive material disposed therein. The fan is assembled within the first hole.

A heat sink assembly for an electrical socket of the present invention comprises a heat sink and a latching member latching with a pair of lugs on the socket. The heat sink comprises a base plate and a plurality of fins projecting upward therefrom. A receiving channel is integrally formed by a pressing means between the fins in the base plate for receiving the latching member. A pair of positioning pins depend downward from a bottom surface of the base plate to tightly engage in a slit between the electric socket and a CPU mounted thereon for positioning the heat sink assembly on the CPU and keeping it from moving along the CPU.

Heat sink assembly for an electrical socket

A heat sink assembly includes a heat sink, a clip and a fastener. The heat sink includes a base and a plurality of fins extending upwardly from the base. A slot is defined between the fins. Grooves are defined on opposite sides of a particular row of the fins. The clip defines a spring portion received in the slot of the heat sink. The curved fastener forms a pair of projections with a gap defined therebetween extending inwardly from both ends of the fastener for engaging the corresponding grooves of the heat sink. A tab is defined on one side of the fastener for engagement with an edge of one of the fins.

Heat sink assembly

A heat sink assembly for use in conjunction with an electronic integrated circuit, such as a chip, comprises a heat sink and a pair of retainers. The heat sink includes a plate defining a large number of fins and a flat bottom surface. A locking protrusion is formed at a proper position of each side of the plate. Each retainer comprises a transition portion, two engaging arms perpendicular to each other, and a nail beneath the transition portion. A rectangular sheath is formed on a distal end of each engaging arm for cooperating with a corresponding locking protrusion. Each nail includes a main body, a neck section, a protruding section and a cone section. A slot is defined through the lower portion of the section and through the protruding section and the cone section.

Heat sink and retainer for electronic integrated devices

An attachment includes an upper locking element and a lower locking element assembled together. The upper locking element comprises a main plate, a folded section, a locking section and a locking tip. The lower locking element comprises a spring section, a first and second arms. Protrusions of the upper locking element engage with holes of the lower locking element, and the locking tip engages with a locking slot of the first arm. The lower locking element is strengthened by the upper locking element. The upper locking element acting as a handle for facilitating an assembly/unassembly process of attaching a heat sink to a CPU package.

CPU heat sink attachment

A clip assembly comprises a body and a pair of separate fasteners. The body comprises a base for engaging with a heat sink, a pair of arms extending from opposite diagonal corners of the base, and a pair of end portions formed on free ends of the arms. An elliptical clearance hole is defined in each end portion for allowing movement of the fastener therein during engagement with a corresponding engaging hole of a printed circuit board. A pair of arcuate surfaces is formed proximate opposite transverse sides of each clearance hole. Each fastener comprises an intermediate main portion, and a head and an engaging portion formed on opposite ends of the main portion. The head has a transition section for engaging with the arcuate surfaces of the body to ensure vertical linear movement of the fastener during engagement with the corresponding engaging hole.

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Taipei, Taiwan

Chao-Yang Lee