Chao-Shun Chiu

Title: Innovations of Chao-Shun Chiu in TSV Structures

Introduction

Chao-Shun Chiu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the development of through-silicon via (TSV) structures. His innovative work focuses on enhancing the performance and efficiency of semiconductor devices.

Latest Patents

Chiu holds a patent for a TSV structure having insulating layers with embedded voids. This patent describes a unique design that includes a chip layer, a dielectric liner, and a conductive filler. The invention features a via reentrant from one surface of the semiconductor body, with air-gap cavities formed on the sidewall of the via. These cavities have a depth-to-width ratio of not less than one. The dielectric liner covers the sidewall of the via without filling into the air-gap cavities, while the conductive filler is disposed in the via, also avoiding the air-gap cavities. This design aims to improve the RC delay of the TSV structure, making it a valuable advancement in semiconductor technology.

Career Highlights

Chao-Shun Chiu is currently employed at Powertech Technology Inc., a leading company in the semiconductor packaging and testing industry. His work at Powertech has allowed him to apply his innovative ideas and contribute to the advancement of semiconductor technologies.

Collaborations

Chiu has collaborated with several talented individuals in his field, including Ming-Yi Wang and Yen-Chu Chen. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Chao-Shun Chiu's contributions to the field of semiconductor technology, particularly through his patent on TSV structures, highlight his innovative spirit and dedication to advancing the industry. His work continues to influence the development of more efficient semiconductor devices.