Chao Kun Tseng

Title: Innovations of Chao Kun Tseng

Introduction

Chao Kun Tseng is a notable inventor based in Tu-Chen, Taiwan. He has made significant contributions to the field of electronic packaging through his innovative designs. With a total of 7 patents, Tseng has demonstrated his expertise and creativity in developing solutions that enhance the performance and reliability of electronic devices.

Latest Patents

One of Tseng's latest patents is a mounting assembly for a heat sink. This invention includes a mounting frame that utilizes two clips and an operating body. Each clip features a central portion with two arms that extend from opposite ends. The hooks on the arms engage with retaining holes in the mounting frame, ensuring that the heat sink firmly contacts an electronic package. Another significant patent is a heat sink assembly designed for dissipating heat from an electronic package mounted on an electrical socket. This assembly comprises a heat sink with a base plate and fins, along with a latching member that secures the heat sink in place. The design includes a receiving channel for the latching member and positioning tabs that prevent movement along the CPU.

Career Highlights

Chao Kun Tseng has worked with prominent companies in the electronics industry, including Foxconn Precision Components Co., Ltd. and Hon Hai Precision Industry Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.

Collaborations

Throughout his career, Tseng has collaborated with talented individuals such as Chao-Yang Lee and Yeu-Lih Lin. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Chao Kun Tseng's contributions to the field of electronic packaging through his patents and collaborations highlight his role as an influential inventor. His innovative designs continue to impact the industry positively.