Foxconn Precision Components Co., Ltd.

Hon Hai Precision Industry Co., Ltd.

Chao Kun Tseng

Chao-Yang Lee

Yeu-Lih Lin

Wei-Ta Lo

Chung-Yung Sun

Chung-Tung Sun

Yu Pin Chen

Jianhua Gu

Kuo Chuang Lin

A mounting a heat sink ( ) in a mounting frame ( ) includes two clips ( ) and an operating body ( ). Each clip has a central portion ( ) and two arms ( ) depending from opposite ends of the central portion respectively. Two hooks ( ) extend inwardly from a distal end of each arm. The operating body includes a main beam ( ), two pressing tabs ( ) formed from upper edges of opposite ends of the main beam respectively, and two ears ( ) extending coplanarly outwardly from bottom portions of the opposite ends of the main beam respectively. When the pressing tabs are depressed, they drive adjacent arms of the clips to move downwardly until the hooks of said adjacent arms are snappingly engaged in corresponding retaining holes of the mounting frame. Thus the clips press the heat sink to firmly contact an electronic package within the mounting frame.

Mounting assembly for heat sink

A heat sink assembly for an electrical socket of the present invention comprises a heat sink and a latching member latching with a pair of lugs on the socket. The heat sink comprises a base plate and a plurality of fins projecting upward therefrom. A receiving channel is integrally formed between the fins in the base plate for receiving the latching member. A pair of positioning tabs depends downward from a bottom surface of the base plate to tightly engage in a slit between the electric socket and a CPU mounted thereon for positioning the heat sink assembly on the CPU and keeping it from moving along the CPU. The receiving channel and the fins extend in a first direction while the tabs extend in a second direction vertical to the first direction.

Heat sink assembly for dissipating heat of an electronic package mounted on an electrical socket

A heat dissipation device includes a heat sink ( ) and an assembling device for securing the heat sink to a, chip ( ) mounted on a printed circuit board ( ). The heat sink has a pair of ears ( ) each defining an aperture ( ) therein. The assembling device includes a clip ( ), a pair of sleeves ( ) each defining a cavity ( ) therethrough, and a pair of springs ( ). Each sleeve extends through the aperture of a corresponding ear of the heat sink, and the springs are disposed respectively between the ears and an end of the sleeves. The clip has a pair of posts ( ) for extending through the printed circuit board to engage with the corresponding cavities.

Heat dissipation device for integrated circuits

A method for making a folded fin for a heat sink comprises the steps of: preparing a metal plate; clamping the metal plate with three forming jigs in an initial position, the lower jig portion of the second forming jig having a tapered end; actuating the second forming jig to upwardly move toward the first forming jig at a specified angle and the third forming jig to horizontally move toward the first forming jig to a second position where a portion of the metal plate between the forming jigs has been bent into a pair of symmetrically inclined sections; and actuating the lower jig portion of the second forming jig to downwardly move away from the metal plate at a specified angle, and the third forming jig and the upper jig portion of the second forming jig to continue moving toward the first forming jig to a final position where the pair of symmetrically inclined sections of the metal plate has been bent double thereby forming a folded fin. A machine is disclosed to make the folded fin by the method disclosed above.

Method and machine for making folded fins for a heat sink

A heat sink includes a base and a number of fins extending from a top face of the base. A groove is defined in a bottom face of the base opposite the fins for receiving a flip chip of a flip chip processor thereby reducing damage to the flip chip during mounting the heat sink to the flip chip processor. At least one elongate protrusion extends from the base for engaging with an edge of a substrate of the flip chip processor to properly position the heat sink with respect to the flip chip processor.

Heat sink for integrated circuit

A heat sink assembly for an electrical socket of the present invention comprises a heat sink and a latching member latching with a pair of lugs on the socket. The heat sink comprises a base plate and a plurality of fins projecting upward therefrom. A receiving channel is integrally formed by a pressing means between the fins in the base plate for receiving the latching member. A pair of positioning pins depend downward from a bottom surface of the base plate to tightly engage in a slit between the electric socket and a CPU mounted thereon for positioning the heat sink assembly on the CPU and keeping it from moving along the CPU.

Heat sink assembly for an electrical socket

A heat sink assembly for use in conjunction with an electronic integrated circuit, such as a chip, comprises a heat sink and a pair of retainers. The heat sink includes a plate defining a large number of fins and a flat bottom surface. A locking protrusion is formed at a proper position of each side of the plate. Each retainer comprises a transition portion, two engaging arms perpendicular to each other, and a nail beneath the transition portion. A rectangular sheath is formed on a distal end of each engaging arm for cooperating with a corresponding locking protrusion. Each nail includes a main body, a neck section, a protruding section and a cone section. A slot is defined through the lower portion of the section and through the protruding section and the cone section.

Growing community of inventors

Tu-Chen, Taiwan

Chao Kun Tseng