Chao-Jian Huang

Title: Chao-Jian Huang: Innovator in Substrate Polishing Technology

Introduction

Chao-Jian Huang is a notable inventor based in Tainan, Taiwan. He has made significant contributions to the field of substrate polishing technology, particularly through his innovative patent.

Latest Patents

Chao-Jian Huang holds a patent for a CMP inner ring in a smart head. This invention provides an apparatus for substrate polishing, which includes a housing member, a carrier member, and a distal force assembly. The carrier member is coupled to and disposed radially outward of the housing member. The distal force assembly is positioned radially inward of an exterior portion of the carrier member and radially outward of the housing member. It features a bladder seal and a seal ring in contact with the bladder seal. The seal ring has a face with one or more grooves that include a plateau radius and a ridge radius, which are designed to enhance the efficiency of the polishing process. The dimensions of these radii are between about 0.012 to about 0.018 inches. Additionally, the distal force assembly includes a transfer ring coupled to the seal ring opposite the bladder.

Career Highlights

Chao-Jian Huang is currently employed at Applied Materials, Inc., a leading company in the semiconductor and display industries. His work focuses on developing advanced technologies that improve the performance and efficiency of substrate polishing.

Collaborations

Chao-Jian Huang collaborates with Tsu-Hui Yang, a fellow innovator in the field. Their partnership contributes to the advancement of technologies that are crucial for the semiconductor industry.

Conclusion

Chao-Jian Huang's contributions to substrate polishing technology through his patent demonstrate his innovative spirit and commitment to advancing the field. His work at Applied Materials, Inc. continues to influence the industry positively.