Company Filing History:
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1 out of 63 Years Active: 2004-2016
Title: Chao-Chin Wu: Innovator in Multichip Package Structures
Introduction
Chao-Chin Wu is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the development of multichip package structures. With a total of nine patents to his name, Wu's innovations have advanced the efficiency and functionality of electronic devices.
Latest Patents
Wu's latest patents focus on methods of manufacturing multichip package structures. One of his notable inventions involves a method that includes providing a substrate body and placing multiple light-emitting chips on it. The light-emitting chips are electrically connected to the substrate body. Surrounding liquid colloid is formed on the substrate to encase the light-emitting chips. The outer layer of this colloid is naturally dried at room temperature to create a semidrying surrounding light-reflecting frame. This frame consists of a non-drying colloid body and a dried outer layer that completely covers it. Finally, a package colloid body is formed to cover the light-emitting chips, ensuring that the semidrying surrounding light-reflecting frame contacts and surrounds the package colloid body.
Career Highlights
Throughout his career, Chao-Chin Wu has worked with notable companies such as Paragon Semiconductor Lighting Technology Co., Ltd. and Ritdisplay Corporation. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in semiconductor technology.
Collaborations
Wu has collaborated with talented individuals in his field, including Chia-Tin Chung and Fang-Kuei Wu. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.
Conclusion
Chao-Chin Wu is a distinguished inventor whose work in multichip package structures has significantly impacted the semiconductor industry. His innovative methods and collaborations continue to shape the future of electronic device manufacturing.