The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 2010
Filed:
Sep. 15, 2009
Chao-chin Wu, Taipei, TW;
Shen-ta Yang, Taipei, TW;
Chao-Chin Wu, Taipei, TW;
Shen-Ta Yang, Taipei, TW;
Paragon Semiconductor Lighting Technology Co., Ltd., Taoyuan County, TW;
Abstract
An LED package structure with standby bonding pads for increasing wire-bonding yield includes a substrate unit, a light-emitting unit, a conductive wire unit and a package unit. The substrate unit has a substrate body and a plurality of positive pads and negative pads. The light-emitting unit has a plurality of LED chips. The positive electrode of each LED chip corresponds to at least two of the positive pads, and the negative electrode of each. LED chip corresponds to at least two of the negative pads. Every two wires of the conductive wire unit are respectively electrically connected between the positive electrode of each LED chip and one of the at least two positive pads and between the negative electrode of each LED chip and one of the at least two negative pads. The package unit has a translucent package resin body on the substrate body to cover the LED chips.