The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2016

Filed:

Jul. 20, 2015
Applicant:

Paragon Semiconductor Lighting Technology Co., Ltd., New Taipei, TW;

Inventors:

Chia-Tin Chung, Miaoli County, TW;

Chao-Chin Wu, Taipei, TW;

Fang-Kuei Wu, Taoyuan County, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/28 (2006.01); H01L 33/54 (2010.01); H01L 33/60 (2010.01);
U.S. Cl.
CPC ...
H05K 3/285 (2013.01); H01L 33/54 (2013.01); H01L 33/60 (2013.01); H05K 3/284 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/181 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/2054 (2013.01); Y10T 29/49146 (2015.01); Y10T 29/49147 (2015.01);
Abstract

A method of manufacturing a multichip package structure includes: providing a substrate body; placing a plurality of light-emitting chips on the substrate body, where the light-emitting chips are electrically connected to the substrate body; surroundingly forming surrounding liquid colloid on the substrate body to surround the light-emitting chips; naturally drying an outer layer of the surrounding liquid colloid at a predetermined room temperature to form a semidrying surrounding light-reflecting frame, where the semidrying surrounding light-reflecting frame has a non-drying surrounding colloid body disposed on the substrate body and a dried colloid outer layer totally covering the non-drying surrounding colloid body; and then forming a package colloid body on the substrate body to cover the light-emitting chips, where the semidrying surrounding light-reflecting frame contacts and surrounds the package colloid body.


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