Taipei, Taiwan

Chao-Chieh Chen

USPTO Granted Patents = 17 

Average Co-Inventor Count = 2.7

ph-index = 6

Forward Citations = 111(Granted Patents)


Company Filing History:


Years Active: 2016-2022

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17 patents (USPTO):Explore Patents

Title: Innovations of Chao-Chieh Chen

Introduction

Chao-Chieh Chen is a prominent inventor based in New Taipei, Taiwan. He has made significant contributions to the field of electrical connectors and CPU socket designs. With a total of 17 patents to his name, Chen's work showcases his expertise and innovative spirit.

Latest Patents

One of his latest patents is the "Mixer pitch arrangement for CPU socket." This invention involves a CPU socket with an insulative housing that features two groups of contacts with different pitches. The design allows for the contacting arms to extend in opposite directions, effectively counterbalancing the imposed forces when a CPU is received. Another notable patent is the "Electrical connector and method thereof making the same." This patent describes an electrical connector that includes multiple rows of contact modules, each with contacts that are integrally formed within an insulator. The design ensures that the contacts can be efficiently assembled and function effectively within the housing.

Career Highlights

Chao-Chieh Chen has worked with notable companies such as Foxconn Interconnect Technology Limited and Foxconn (Kunshan) Computer Connector Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.

Collaborations

Throughout his career, Chen has collaborated with talented individuals, including Chih-Pi Cheng and Ming-Lun Szu. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Chao-Chieh Chen's contributions to the field of electrical connectors and CPU socket designs highlight his innovative capabilities and dedication to advancing technology. His patents reflect a deep understanding of engineering principles and a commitment to improving electronic connectivity.

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